, 2010Doctoral Studies in the Department of Mechanical Engineering ,University of Waterloo Study Subject: Electronic Packaging Employer: University of Waterloo Level:PhD Scholarship Description: This position is for research in electronic packaging materials, processes, and advanced methods. Collaboration with existing industrial partners is required. Success is measured by number and quality of publications.Requirements - university degree in science or engineering - hands-on experience in electronics packaging - strong communication skillsScholarship Application Deadline: January 31st 2010Further Scholarship Information and
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